Mitsubishi Heavy Industries Ltd (MHI) has developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, dubbed the "Bond Meister MWB-12-ST," capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature. The company delivered the first unit to the National Institute of Advanced Industrial Science and Technology (AIST). Leveraging the new machine's ability to eliminate heat stress and strain in the bonding process and help achieve high productivity, MHI looks to contribute to efforts to further enhance the capacity and performance of LSIs, which currently face limitations in miniaturization.
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